Good Quality Factory Directly Reactive PUR Hot Melt Adhesive WANLI®
PUR-9002.1 with Viscosity About 6500mPa·s @140℃(Brookfield-ASTM
D3236) for Flat Lamination Bonding of Decorative Panels Application
Wanli® PUR hot melt adhesive PUR-9002.1 for woodworking flat lamination bonding is a single-component
reactive PUR hot melt adhesive with 100% solid content. PUR-9002.1 can be used for the lamination of plastic films/aluminized films to
wood/wood-plastic materials. PUR-9002.1 has high initial strength and moderate open time. PUR-9002.1 is featured stable viscosity under heating at a certain
temperature, high initial bonding strength and final bonding
strength. After curing, PUR-9002.1 has good peeling strength, good heat&humidity resistance and
chemical resistance.
APPLICATION
Wanli® PUR hot melt adhesive PUR-9002.1 is used for woodworking
flat lamination bonding. PUR-9002.1 can be used for the lamination of plastic films/aluminized films to
wood/ wood-plastic materials.
| Application Material | Decorative Panels Lamination Bonding |
| Appearance | White & Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Flat Lamination Bonding |
| Solid Content | 100% |
| Operating Temperature | 130～140℃( Depend On Equipment, Substrate, Environment And Other Conditions) |
| Melt Viscosity | Approximate 6500mPa·s @140℃(Brookfield-ASTM D3236) |
| Open Time | 5-6min |
| Usage Scope | Lamination of Plastic Films/Aluminized Films to Wood/Wood-plastic
Materials |
| Shelf Life | Half A Year |
| Package | 2Kg/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength.
PUR-9002.1 has good peeling strength, good heat&humidity resistance and
chemical resistance after curing.
USER GUIDE
The package of PUR-9002.1 is suitable for various dispensing
equipment.
The recommended operating temperature is 130℃~140℃.
It is better to place finished product in a working environment
with suitable temperature and humidity (recommended temperature:
23~25 ℃, about 65% relative humidity)to achieve complete curing.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
