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Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

    Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
     
    Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
    • Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
    • Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
    • Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
    • Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers
    • Buy cheap Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A from wholesalers

    Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

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    Brand Name : WANLI-ADHESION
    Model Number : PUR-7563A
    Certification : ISO9001 ISO14001 IATF16949
    Payment Terms : L/C, T/T
    Delivery Time : 5-8 work days
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    Aluminum PUR Hot Melt Adhesives Edge Bonding Chip Particle Density Foam PUR-7563A

    Polyurethane hot melt glue PUR-7563A can be used for a broad spectrum of adhesion to different edgeband materials. Fast adhesive setting for direct downline processing and high heat resistance and durability. Wanli supplies these hot melt adhesives of the latest generation also in granulate form. The ease of processing makes them particularly attractive for processers who have not used the PUR technology before


    Wanli® PUR hot melt adhesive PUR-7563A for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7563A is a cleaning free glue, which is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates. PUR-7563A is featured stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.

    APPLICATION
    Wanli® PUR hot melt adhesive PUR-7563A is used for edge bonding. PUR-7563A is mainly used for edge bonding of solid wood materials, MDF, foam boards and other substrates.

    Application MaterialWoodworking Edgebanding Hot Melt Adhesives
    AppearanceWhite Solid
    ComponentPUR (Polyurethane)
    Application IndustryWoodworking Edgebanding
    Solid Content100%
    Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
    Melt ViscosityAbout 65000cps@120℃(Brookfield-ASTMD3236)
    Open TimeAbout 10s@25℃
    Usage ScopeEdge Bonding of Wood Materials - Chip Board
    Shelf Life6 Months
    Package500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel


    FEATURE
    Stable viscosity under heating at a certain temperature.
    Short open time.
    High initial bonding strength.
    High final bonding strength and no cleaning.

    USER GUIDE
    The package of PUR-7563A is suitable for various dispensing equipment.
    The recommended operating temperature is 120℃~140℃.
    It is better to place finished product in a working environment with suitable temperature and humidity to achieve complete curing (recommended temperature: 23~25℃, about 65% relative humidity).

    STORAGE
    Dry, cool, avoid direct sunlight, no more than 35℃.


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