Sign In | Join Free | My himfr.com
Home > PUR Hot Melt Adhesives >

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

    Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
     
    Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
    • Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
    • Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
    • Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
    • Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers
    • Buy cheap Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 from wholesalers

    Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

    Ask Lasest Price
    Brand Name : WANLI-ADHESION
    Model Number : PUR-XBB768
    Certification : ISO9001 ISO14001 IATF16949
    Payment Terms : L/C, T/T
    Delivery Time : 5-8 work days
    • Product Details
    • Company Profile

    Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

    Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.


    Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.

    APPLICATION
    Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

    Application MaterialWoodworking Edgebanding Hot Melt Adhesives
    AppearanceIvory White Solid
    ComponentPUR (Polyurethane)
    Application IndustryWoodworking Edgebanding
    Solid Content100%
    Operating Temperature120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
    Melt ViscosityAbout 55000mPa·s@120℃(Brookfield-ASTMD3236)
    Open Time8~15s@25℃
    Usage ScopeEdge Bonding of Wood Materials - Chip Board
    Shelf Life6 Months
    Package2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel


    FEATURE
    Very good initial adhesion.
    Suitable opening time.
    High final bonding strength.

    USER GUIDE
    The package of PUR-XBB768 is suitable for various dispensing equipment.
    The recommended operating temperature is 120℃~140℃.
    It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.

    STORAGE
    Dry, cool, avoid direct sunlight, no more than 35℃.


    Quality Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: WUXI WANLI ADHESION MATERIALS CO., LTD.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)