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Brand Name : | WANLI-ADHESION |
Model Number : | PUR-7562.1 |
Certification : | ISO9001 ISO14001 IATF16949 |
Payment Terms : | L/C, T/T |
Delivery Time : | 5-8 work days |
Good Quality Factory Directly WANLI® PUR-7562.1 Ivory 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding During High Quality Furniture Production
Wanli® PUR hot melt adhesive PUR-7562.1 for edge bonding is a
single-component reactive PUR hot melt adhesive with 100% solid
content. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to
various surface materials. PUR-7562.1 is featured good initial adhesion, suitable opening time, high
bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-7562.1 is used for edge bonding. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to various surface materials.
Application Material | Woodworking Edgebanding Hot Melt Adhesives |
Appearance | Ivory / Solid |
Component | PUR (Polyurethane) |
Application Industry | Reactive PUR Hot Melt Adhesive for Woodworking Edgebanding |
Solid Content | 100 Percent |
Operating Temperature | 120~140 ℃ |
Melt Viscosity | About 75000mPa·s@120℃(Brookfield-ASTMD3236) |
Open Time | 8~15s@25℃ |
Usage Scope | Edge Bonding of Wood Materials- Chip Board |
Shelf Life | 6 Months |
Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Very good initial adhesion.
Suitable opening time.
High bonding strength.
USER GUIDE
The package of PUR-7562.1 is suitable for various dispensing
equipment. The recommended operating temperature is 120℃~140℃. In
order to achieve complete curing, it is better to place finished
product in a working environment with suitable temperature and
humidity (recommended temperature: 23~25℃, about 55% relative
humidity).
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight.
The storage temperature should be no more than 35℃ and avoid open
fire or heat source.
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