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Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830

    Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
     
    Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
    • Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
    • Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
    • Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
    • Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers
    • Buy cheap Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830 from wholesalers

    Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830

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    Brand Name : WANLI-ADHESION
    Model Number : PUR-8830
    Certification : ISO9001 ISO14001 IATF16949
    Price :
    Payment Terms : L/C, T/T
    Supply Ability :
    Delivery Time : 5-8 work days
    • Product Details
    • Company Profile

    Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830

    Factory Direct Supply Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive WANLI® PUR-8830 with Open Time 3~5 Minutes at 25℃ for Electrical Structural Bonding, Perfect Bonding Strength


    Wanli® PUR hot melt adhesive PUR-8830 for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. It is especially suitable for bonding applications in the electronic industry.


    APPLICATION

    Wanli® PUR hot melt adhesive PUR-8830 is used for electronics structural bonding. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is especially suitable for bonding applications in the electronic industry.


    Application MaterialElectrical Structural Bonding PUR Hot Melt Adhesives
    AppearanceIvory White Solid
    ComponentPUR (Polyurethane)
    Application IndustryElectronics Structural Bonding
    Solid Content100%
    Operating TemperatureAbout 110℃( Depend On Machine, Substrate, Environment And Other Conditions)
    Melt Viscosity3000~6000cps@110℃(Brookfield-ASTMD3236)
    Open Time3~5min@25℃
    CuringNormal Temperature Curing
    Usage ScopeElectronics Coils Bonding
    Shelf Life6 Months
    Package30ml/Plastic Tube

    FEATURE

    Stable viscosity under heating at a certain temperature.

    High initial bonding strength and final bonding strength.

    After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance.


    USER GUIDE

    The package of PUR-8830 is suitable for various dispensing equipment. The recommended operating temperature is about 110℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).


    STORAGE

    Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.


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