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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

    Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
     
    Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
    • Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
    • Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
    • Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
    • Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers
    • Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 from wholesalers

    Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

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    Brand Name : WANLI-ADHESION
    Model Number : EVA-JF-108
    Certification : ISO9001 ISO14001 IATF16949
    Payment Terms : L/C, T/T
    Delivery Time : 5-8 work days
    • Product Details
    • Company Profile

    Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

    Hot Sale Factory Direct 100% Solid White Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-108 for Edge Bonding with High Bonding Strength


    Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.


    APPLICATION

    Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.


    Application MaterialWoodworking Edgebanding Hot Melt Adhesives
    AppearanceWhite Solid Particles
    ComponentEVA
    Application IndustryWoodworking Edgebanding
    Solid Content100%
    Operating Temperature180~200℃( Depend On Machine, Substrate, Environment And Other Conditions).
    Softening Temperature95~105℃
    Melt Viscosity70000±10000mpa·s (200℃)
    CuringNormal Temperature Curing
    Usage ScopeEdge Bonding of Wood Materials- Chip Board
    Shelf Life2 * Years
    Package25Kg/Bag

    FEATURE

    High bonding strength, lower cost and fast curing


    USER GUIDE

    The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.


    STORAGE

    Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.


    Quality Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 for sale
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